The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Aug. 05, 2022
Applicant:

Dexerials Corporation, Tochigi, JP;

Inventors:

Sarii Yamaguchi, Tochigi, JP;

Hidetsugu Namiki, Tochigi, JP;

Takeshi Nishio, Tochigi, JP;

Assignee:

DEXERIALS CORPORATION, Tochigi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/02 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B23K 35/262 (2013.01);
Abstract

A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mmor greater and 1,500 N/mmor less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.


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