The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Dec. 27, 2023
Seiko Epson Corporation, Tokyo, JP;
Shunsuke Uchizono, Shiojiri, JP;
Yasutoshi Hideshima, Matsumoto, JP;
Setsuya Iwashita, Nirasaki, JP;
Fumiya Maeda, Matsumoto, JP;
Koichi Ozaki, Okayama, JP;
Tadao Fukuta, Kurashiki, JP;
SEIKO EPSON CORPORATION, , JP;
Abstract
A thixotropically molded product includes: a matrix portion containing Mg as a main component; a first particle portion dispersed in the matrix portion and containing SiC as a main component; a second particle portion dispersed in the matrix portion and containing MgSi as a main component; and a third particle portion dispersed in the matrix portion and containing MgO as a main component. An area fraction of the first particle portion in a cross section is 0.68 or more and 19.6% or less.