The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Mar. 12, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Ruijun Deng, Beijing, CN;

Zhukai Liu, Beijing, CN;

Ding Ding, Beijing, CN;

Haonan Liu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B01L 7/00 (2006.01); B01L 99/00 (2010.01);
U.S. Cl.
CPC ...
B01L 7/52 (2013.01); B01L 3/502707 (2013.01); B01L 2300/12 (2013.01); B01L 2300/1827 (2013.01);
Abstract

The present disclosure provides a microfluidic substrate, a microfluidic chip and a manufacturing method thereof. The microfluidic substrate includes: a first substrate; a conductive layer on the first substrate; and a defining layer on a side of the conductive layer facing away from the first substrate, the defining layer defining a concave portion; wherein the conductive layer comprises a plurality of conductive patterns corresponding to the concave portion, the plurality of conductive patterns are arranged along a first direction, each conductive pattern extends along a second direction and comprises a first end and a second end, the first direction is perpendicular to the second direction, and each conductive pattern has a maximum local resistance value at the first end and the second end of the conductive pattern.


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