The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Sep. 27, 2024
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kaori Yoda, Shiojiri, JP;

Ryoichi Shimura, Azumino, JP;

Mio Sasaki, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/08 (2006.01);
U.S. Cl.
CPC ...
A61B 8/0858 (2013.01);
Abstract

A thickness calculation method for calculating a thickness of a tissue in a living body by a computer, a processor of the computer performs acquiring received data based on a reception signal of an ultrasonic wave for a target living body, classifying the target living body into one of a first attribute and a second attribute based on the acquired received data, (i) calculating a thickness of a target tissue by inputting the acquired received data into a first training model, when the target living body is classified into the first attribute, and calculating the thickness of the target tissue by inputting the acquired received data into a second training model, when the target living body is classified into the second attribute.


Find Patent Forward Citations

Yoda, Kaori. (2026). Thickness calculation method, calculation device, and program (U.S. Patent No. 12690836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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