The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Dec. 01, 2022
Renesas Electronics Corporation, Tokyo, JP;
Renesas Electronics Corporation, Tokyo, JP;
Abstract
Improving a performance of a semiconductor device. A method of manufacturing the semiconductor device, including steps of: forming a first convex portion on a front surface of a chip mounting portion; and mounting a semiconductor chip on the front surface of the chip mounting portion via a conductive adhesive material. Here, the semiconductor chip includes: a main transistor forming portion in which a main transistor is formed; and a sense transistor forming portion in which a sense transistor is formed. Also, in the step for mounting the semiconductor chip on the chip mounting portion, the semiconductor chip is mounted on the front surface of the chip mounting portion such that the sense transistor forming portion of the semiconductor chip overlaps the first convex portion formed on the front surface of the chip mounting portion in the step for forming the first convex portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile