The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Dec. 18, 2023
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Jason Paulsen, Robins, IA (US);
Nathaniel T. Oster, Marion, IA (US);
Nathan Van Schaick, Marion, IA (US);
Mary L. Detweiler, Williamsburg, IA (US);
Jodee Mae Ross, Cedar Rapids, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
A method for modifying a ball grid array (BGA) component for attachment to a host circuit board includes exposing a set of contact points, and connective paths between the contact points, on the surface of the BGA component. Connections between the contact points are modified (e.g., reworking damaged connections, adding connections overlooked in the design phase or missed in the build phase) by printing or depositing functional materials (e.g., conductive, dielectric, resistive) along paths between the exposed contact points, e.g., via aerosol jetting. If the BGA component is already soldered to a host circuit board, the component is first desoldered and detached prior to modification. After deposition of functional materials, the BGA component is treated to cure the materials and achieve any desired electrical properties associated with the materials and/or modification.