The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jul. 06, 2022
Applicant:

3d Glass Solutions, Inc., Albuquerque, NM (US);

Inventors:

Jeb H. Flemming, Albuquerque, NM (US);

Jeff A. Bullington, Orlando, FL (US);

Kyle Mcwethy, Albuquerque, NM (US);

Assignee:

3D Glass Solutions, Inc., Albuquerque, NM (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H05K 1/02 (2006.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 40/259 (2026.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H10W 20/427 (2026.01); H05K 2201/093 (2013.01); H05K 2201/1056 (2013.01);
Abstract

The present invention includes a method of making a thermal management and signal control structure comprising forming in a substrate heat conductive vias and control vias, power vias, and ground vias, wherein the heat conductive vias and the control vias, power vias, and vias are aligned to a first metal plate on a first side of the substrate, wherein the control vias, power vias, and ground vias are surrounded by a glass layer; forming a second metal plate on a second side of the substrate, wherein the second metal plate is connected to the heat conductive vias; and forming a pad on each of the control vias, power vias, and ground vias, wherein each pad is configured to electrically connect the thermal management and signal control structure to at least one of: a printed circuit board, an integrated circuit, or a power management unit.


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