The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Dec. 13, 2022
Applicant:
Lx Semicon Co., Ltd., Daejeon, KR;
Inventors:
Tae Ryong Kim, Daejeon, KR;
Deog Soo Kim, Daejeon, KR;
Assignee:
LX SEMICON CO., LTD, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 90/10 (2026.01);
U.S. Cl.
CPC ...
H10W 40/255 (2026.01); H10W 74/016 (2026.01); H10W 74/121 (2026.01); H10W 74/47 (2026.01); H10W 90/401 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 90/00 (2026.01); H10W 90/10 (2026.01);
Abstract
The present disclosure relates to a power semiconductor module of which heat is dissipated by its both sides and provides a power semiconductor module technology in which a mold is formed in a surrounding space of a power semiconductor die, and then, wires are formed on upper and lower sides of the power semiconductor die and substrates are disposed on upper and lower sides of the wires.