The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Apr. 22, 2022
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventor:

Dong Ha Kim, Icheon-si, KR;

Assignee:

SK HYNIX INC., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/8027 (2025.01); H10F 39/8033 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01);
Abstract

An image sensing device includes a semiconductor substrate including photoelectric conversion regions that correspond to unit pixels, respectively, each photoelectric conversion region generating photocharges through conversion of incident light, and a plurality of first color filters disposed over a first surface of the semiconductor substrate to transmit incident light of a first color to the photoelectric conversion regions of first unit pixels. The first unit pixels have different substrate thicknesses from one another.


Find Patent Forward Citations

Kim, Dong. (2026). Image sensing device including multi-thickness substrate (U.S. Patent No. 12690284). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690284

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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