The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Sep. 28, 2023
Applicant:

Eagle Technology, Llc, Melbourne, FL (US);

Inventors:

Matt Bauer, Melbourne, FL (US);

Jamel Burruss, Palm Bay, FL (US);

Steven Kobosko, Vienna, VA (US);

Assignee:

Eagle Technology, LLC, Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/47 (2025.01); H01C 1/01 (2006.01); H01C 7/00 (2006.01); H01C 17/22 (2006.01); H01C 17/30 (2006.01); H10D 86/85 (2025.01); H10W 70/05 (2026.01); H10W 70/67 (2026.01); H10W 70/69 (2026.01);
U.S. Cl.
CPC ...
H10D 1/474 (2025.01); H01C 1/01 (2013.01); H01C 17/22 (2013.01); H01C 17/30 (2013.01); H10D 86/85 (2025.01); H10W 70/05 (2026.01); H10W 70/688 (2026.01); H01C 7/006 (2013.01); H10W 70/69 (2026.01);
Abstract

A method comprising: forming a polyimide layer; forming a thin film resistor on the polyimide layer; forming, on the thin film resistor and the polyimide layer, a metallization layer that includes metal contacts on opposing ends of the thin film resistor but leaves an exposed surface of the polyimide layer; baking the polyimide layer, the thin film resistor, and the metallization layer to remove water from the polyimide layer; forming, on the exposed surface of the polyimide layer, a hydrophobic moisture barrier layer that prevents absorption of water into the polyimide layer to avoid blistering of the thin film resistor during subsequent laser trimming of the thin film resistor; and laser trimming a resistance of the thin film resistor between the metal contacts.


Find Patent Forward Citations

Bauer, Matt. (2026). Method of fabricating high accuracy embedded resistors in flex substrates (U.S. Patent No. 12690199). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690199

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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