The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Apr. 24, 2023
Applicant:

Asia Vital Components Co., Ltd., New Taipei City, TW;

Inventor:

Qian-Cheng Lin, New Taipei City, TW;

Assignee:

ASIA VITAL COMPONENTS CO., LTD., New Taipei City, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01);
Abstract

A support structure of heat dissipation unit is applicable in a heat dissipation unit. Two sides of the heat dissipation unit are respectively formed with a condensation side and an evaporation side. Two ends of the support structure respectively abut against and connect with the condensation side and the evaporation side. The support structure includes a base section and a thorny section. The base section has a contact face and a support face. The thorny section is composed of multiple thorny columns arranged on the support face of the base section in an array. The thorny columns are arranged at intervals, whereby a passage is defined between each two adjacent thorny columns. The support structure with the thorny section serves to speed vapor-liquid circulation in the heat dissipation unit and increase flowing speed of the working fluid so as to greatly enhance heat dissipation performance.


Find Patent Forward Citations

Lin, Qian-Cheng. (2026). Support structure of heat dissipation unit (U.S. Patent No. 12690167). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12690167

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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