The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Nov. 21, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Ki Hwan You, Suwon-si, KR;
Seung Ju Lee, Suwon-si, KR;
Tae Hun Kim, Suwon-si, KR;
Chang Gon Kim, Suwon-si, KR;
Yeon Ji Kim, Suwon-si, KR;
Young Gon Kim, Suwon-si, KR;
Ho Kwon Yoon, Suwon-si, KR;
Eun Seok Kang, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board includes: a first insulating layer; a first circuit layer disposed on one surface of the first insulating layer and including a connection pad; a second insulating layer disposed on the one surface of the first insulating layer and embedding the first circuit layer; a via penetrating through the second insulating layer and connected to the first circuit layer; a metal post disposed on one surface of the second insulating layer and connected to the via; and a hole penetrating through the second insulating layer and exposing at least a portion of the connection pad of the first circuit layer. The metal post is spaced apart from the hole, and protrudes from the second insulating layer.