The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Nov. 18, 2022
Kollmorgen Corporation, Radford, VA (US);
Jeffery Todd Brewster, Dublin, VA (US);
Heather Cassidy Hawley, Blacksburg, VA (US);
William Edward Anderson, IV, Blacksburg, VA (US);
Tyler William Wood, Radford, VA (US);
George Edward Midkiff, Pulaski, VA (US);
Elizabeth Cantando, Blacksburg, VA (US);
KOLLMORGEN CORPORATION, Radford, VA (US);
Abstract
A printed circuit board has a solder joint inspection system including a substrate surface having at least one solder pad thereon, at least one conductor wire having an end attached to the at least one solder pad, and a first inspection feature. A first inspection feature is marked on the substrate surface adjacent to the at least one solder pad to define a conductor end zone on the at least one solder pad. The end of the conductor wire is in the conductor end zone when properly attached. The at least one solder pad may define a second inspection feature to mark an extent to which the at least one solder pad is covered by a flow of solder when the wire is properly attached.