The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Jun. 13, 2023
Applicants:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Electric Printed Circuits, Inc., Shiga, JP;
Inventors:
Yoshio Oka, Osaka, JP;
Kazuhiro Miyata, Osaka, JP;
Motohiko Sugiura, Osaka, JP;
Satoshi Kiya, Shiga, JP;
Koji Nitta, Osaka, JP;
Assignees:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0344 (2013.01);
Abstract
A substrate for a printed circuit board includes a base film having a main surface and an electrically conductive layer disposed on the main surface. The base film is made of a fluororesin. The electrically conductive layer is a layer including a plurality of electrically conductive particles bonded together. An amount of nitrogen present in the main surface is 0.2 atomic percent or more.