The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Feb. 03, 2022
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Tetsuya Miyamura, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/424 (2006.01); H01R 13/506 (2006.01); H01R 43/18 (2006.01);
U.S. Cl.
CPC ...
H01R 13/424 (2013.01); H01R 13/506 (2013.01); H01R 43/18 (2013.01);
Abstract

It is aimed to provide a connector not requiring a dedicated assembling facility. A connector () is provided with a primary molding portion (A) made of a primary resin material and a secondary molding portion (A) made of a secondary resin material. The secondary molding portion (A) is provided relatively movably with respect to the primary molding portion (A).


Find Patent Forward Citations

Miyamura, Tetsuya. (2026). Connector with integrally molded resin portions of different materials (U.S. Patent No. 12689146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12689146

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…