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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12689139 B1

PDFFull Text
Date of Patent:
Jul. 21, 2026

Filed:

Jan. 31, 2020

Glass plate module

Applicant:

Nippon Sheet Glass Company, Limited, Tokyo, JP;

Inventors:

Minoru Yoshida, Tokyo, JP;

Junichi Tokiwa, Tokyo, JP;

Assignee:

NIPPON SHEET GLASS COMPANY, LIMITED, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Thien S Tran

Int. Cl.
CPC ...
H01R 12/53 (2011.01); B23K 1/19 (2006.01); B60J 1/00 (2006.01); C03C 17/06 (2006.01); H01Q 1/12 (2006.01); H01R 4/18 (2006.01); H01R 4/58 (2006.01); H01R 12/57 (2011.01); H01R 43/02 (2006.01); H05B 3/06 (2006.01); H05B 3/86 (2006.01);
U.S. Cl.
CPC ...
H01R 12/53 (2013.01); B23K 1/19 (2013.01); B60J 1/001 (2013.01); B60J 1/002 (2013.01); C03C 17/06 (2013.01); H01R 12/57 (2013.01); H01R 43/0256 (2013.01); H05B 3/06 (2013.01); H05B 3/86 (2013.01); H01Q 1/1278 (2013.01); H01R 4/187 (2013.01); H01R 4/58 (2013.01); H05B 2203/016 (2013.01);
Abstract

A glass plate module according to the present invention includes: a glass body; an electrical conductor laminated on the glass body; at least one connection terminal fixed to the conductive layer, and formed of a conductive material; and a lead-free solder for fixing the connection terminal to the conductive layer, and the connection terminal includes a base portion, at least one installation portion coupled to the base portion, and fixed to the conductive layer via the lead-free solder, a power supply portion coupled to the base portion, and to be connected to a cable for supplying power to the conductive layer, and a connection portion that is disposed between the base portion and the power supply portion, and that connects the connection portion to the base portion in a bendable manner.

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