The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Oct. 17, 2023
Applicant:

Clyra Inc., Dover, DE (US);

Inventors:

Xiaohua Liu, Mountain View, CA (US);

Xiahui Yao, San Jose, CA (US);

Sa Zhou, Fremont, CA (US);

Song Han, Foster City, CA (US);

Assignee:

Clyra Inc., Dover, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/04 (2006.01); H01M 4/36 (2006.01); H01M 4/38 (2006.01); H01M 4/583 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/364 (2013.01); H01M 4/044 (2013.01); H01M 4/386 (2013.01); H01M 4/583 (2013.01); H01M 2004/021 (2013.01);
Abstract

Described herein are carbon-silicon composite structures and methods of producing such structures. A carbon-silicon composite structure comprises one or more carbon-containing structures that have pores at least partially filled with silicon-containing structures. Specifically, the silicon-containing structures are attached to the pore walls while maintaining void spaces within these pores. These void spaces can accommodate silicon expansion during lithiation. Carbon-silicon composite structures can be produced by submerging carbon-containing structures into a precursor liquid solution (comprising a precursor) and driving this solution into the pores. The silicon-containing structures are then formed (from the precursor) within the pores either electrochemically (e.g., by applying a voltage to the solution and structures) or chemically (e.g., by introducing the structures into a reducing liquid solution). In some examples, these void spaces are sealed from the environment by additional structures, e.g., separate silicon-containing structures and/or carbon structures.


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