The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Jun. 11, 2024
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Hong Gi Kim, Suwon-si, KR;

Ji Won Lee, Suwon-si, KR;

Byeong Hyeop Ha, Suwon-si, KR;

Jin Il Kang, Suwon-si, KR;

Hong Seok Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction; an external electrode disposed outside the body; and an oxide layer disposed between the body and the external electrode and connecting the internal electrode and the external electrode, wherein the oxide layer includes one or more of an Ni oxide and a Cu oxide.


Find Patent Forward Citations

Kim, Hong. (2026). Multilayer electronic component (U.S. Patent No. 12688971). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12688971

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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