The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Sep. 29, 2025
Applicant:

Next Silicon Ltd., Givatayim, IL;

Inventors:

Daniel Greenspan, Jerusalem, IL;

Nemanja Kondic, Petrovaradin, RS;

Oren Nishry, Beit Lehem HaGlilit, IL;

Roee Barak, Tel Aviv, IL;

Assignee:

NEXT SILICON LTD., Givatayim, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4221 (2013.01); G06F 2213/0026 (2013.01);
Abstract

A system and method of managing data communication over platform-level interconnect protocols may include receiving first and second requests from a source device, each optionally querying data from a destination device, encapsulating the requests as payload and tunnelling them as respective posted messages via a platform-level interconnect protocol. Embodiments may further include transmitting corresponding non-posted messages, triggered by the posted messages, obtaining queried data pertaining to the first request, and encapsulating the queried data as payload and tunnelling it to a sink device as a completion message associated with the second non-posted message. Embodiments may include a pro forma counter configured to increment upon transmission of each non-posted message and decrement upon reception of each completion message, thereby enabling retrieval of queried data while managing outstanding non-posted message limitations of the platform-level interconnect protocol.


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