The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Dec. 20, 2023
Applicant:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Inventors:
Michael Ignatowski, Austin, TX (US);
Michael J. Schulte, Austin, TX (US);
Gabriel Hsiuwei Loh, Bellevue, WA (US);
Assignee:
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G06F 1/3234 (2019.01); G06F 13/16 (2006.01);
U.S. Cl.
CPC ...
G06F 13/1684 (2013.01); G06F 1/3275 (2013.01); G06F 3/0604 (2013.01); G06F 3/0625 (2013.01); G06F 3/0646 (2013.01); G06F 3/0685 (2013.01); G06F 13/1694 (2013.01);
Abstract
Multi-stack compute chip and memory architecture is described. In accordance with the described techniques, a package includes a plurality of computing stacks, and each computing stack includes at least one compute chip and a memory. The package also includes one or more interconnects that couple the computing stacks to at least one other computing stack for sharing the memory in a coherent fashion across the plurality of computing stacks.