The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Apr. 19, 2022
Applicant:

Magic Leap, Inc., Plantation, FL (US);

Inventors:

Vikramjit Singh, Pflugerville, TX (US);

Lorenzo Mcdonald, Pflugerville, TX (US);

Frank Y. Xu, Austin, TX (US);

Assignee:

Magic Leap, Inc., Plantation, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/18 (2006.01); B82Y 20/00 (2011.01); B82Y 40/00 (2011.01); G02B 1/02 (2006.01); G02B 27/01 (2006.01); G02B 25/00 (2006.01);
U.S. Cl.
CPC ...
G02B 5/1857 (2013.01); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); G02B 1/02 (2013.01); G02B 5/1809 (2013.01); G02B 5/1814 (2013.01); G02B 25/001 (2013.01); G02B 27/0172 (2013.01); G02B 2027/0178 (2013.01);
Abstract

Disclosed herein are systems and methods for fabricating nanostructures on a substrate that can be used in eyepieces for displays, e.g., in head wearable devices. Fabricating and/or etching such a substrate can include submerging the substrate in a bath and applying ultrasonication to the bath for a first time period. The ultrasonication applied to the first bath can agitate the fluid to provide a substantially uniform first reactive environment across the surface of the substrate. The substrate can be submerged in a second bath and ultrasonication can be applied to the second bath for a second time period. The ultrasonication applied to the second bath can agitate the fluid to provide a substantially uniform second reactive environment across the surface of the substrate. A predetermined amount of material can be removed from the surface of the substrate during the second time period to produce an etched substrate.


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