The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Apr. 25, 2024
Amulaire Thermal Technology, Inc., New Taipei City, TW;
Kuo-Wei Lee, New Taipei City, TW;
Ching-Ming Yang, New Taipei City, TW;
Chi-An Chen, New Taipei City, TW;
Tze-Yang Yeh, New Taipei City, TW;
AMULAIRE THERMAL TECHNOLOGY, INC., New Taipei City, TW;
Abstract
An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 μm. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 μm and 200 μm, and a depth of each of the plurality of micropores is between 100 nm and 50 μm.