The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Sep. 08, 2023
Asustek Computer Inc., Taipei City, TW;
Ing-Jer Chiou, Taipei City, TW;
ASUSTeK COMPUTER INC., Taipei City, TW;
Abstract
A loop type heat dissipation structure includes a heat pipe, a communicating pipe, and working fluid. The heat pipe includes a pipeline, a capillary structure, and a first barrier body. The pipeline has a first evaporation section, a first condensation section, an outlet, and an inlet. The outlet is located at an edge of the first evaporation section, and the inlet is located at an edge of the first condensation section. The capillary structure is distributed on an inner wall surface of the pipeline and extends from the first condensation section to the first evaporation section. The first barrier body is disposed in the first condensation section and is connected to the capillary structure. One end of the communicating pipe is communicated with the outlet, and the other end of the communicating pipe is communicated with the inlet. The working fluid flows in the heat pipe and the communicating pipe.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile