The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2026

Filed:

Mar. 31, 2025
Applicant:

Zhejiang University, Hangzhou, CN;

Inventors:

Kaichen Xu, Hangzhou, CN;

Zimo Cai, Hangzhou, CN;

Huayong Yang, Hangzhou, CN;

Assignee:

Zhejiang University, Hangzhou, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); C23C 18/16 (2006.01); C23C 18/40 (2006.01); H01C 7/00 (2006.01); H10N 97/00 (2023.01);
U.S. Cl.
CPC ...
C23C 18/1612 (2013.01); B05D 3/06 (2013.01); C23C 18/1667 (2013.01); C23C 18/40 (2013.01); H01C 7/008 (2013.01); H10N 97/00 (2023.02); C23C 18/1676 (2013.01);
Abstract

The present disclosure provides a high-temperature resistant nano-copper produced by laser direct writing, a preparation method and an application thereof. The high-temperature resistant nano-copper exhibits excellent oxidation resistance, thermal stability and superior conductivity. In this disclosure, the preparation is simple, and the nano-copper oxide ink can be stored for extended periods without being affected by oxidation. It is suitable for various manufacturing processes including printing, coating, and other similar methods. Moreover, based on laser direct writing, the processing efficiency is high, enabling the one-step integration of multi-performance of the high-temperature resistant nano-copper. The high-temperature resistant nano-copper described in the present disclosure can be used as an interconnection circuit in an integrated sensor system based on all-laser in-situ direct writing, and can be widely applied in fields of aerospace, automobile, electronics, etc.


Find Patent Forward Citations

Xu, Kaichen. (2026). High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof (U.S. Patent No. 12686924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12686924

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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