The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Mar. 14, 2024
GM Global Technology Operations Llc, Detroit, MI (US);
Selina Xinyue Zhao, Rochester Hills, MI (US);
Venkateshwar R. Aitharaju, Troy, MI (US);
Roger G. Ghanem, Los Angeles, CA (US);
Douglas Bradley, Milford, MI (US);
Adam Burley, Auburn Hills, MI (US);
GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, MI (US);
Board of Trustees of Michigan State University, East Lansing, MI (US);
CSP Innovations, Inc., Auburn Hills, MI (US);
Abstract
A resin transfer molding system includes a resin transfer mold configured to mold a composite material via resin injection and curing, a pressure sensor configured to measure an in-mold pressure, a dielectric sensor configured to measure an in-mold degree of cure value, a resistance circuit configured to measure an in-mold flow front position, and a molding process control module configured to determine a molding process anomaly status by comparing a specified anomaly threshold to at least one of pressure data obtained from the at least one pressure sensor, degree of cure data obtained from the at least one dielectric sensor, or flow front position data obtained from the at least one resistance circuit, reduce an injection flow rate in response to a determination of a molding process anomaly, and maintain the injection flow rate in response to a determination of normal molding process operation without the molding process anomaly.