The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Apr. 30, 2020
Hitachi Energy Ltd, Zürich, CH;
Elio Perigo, Wendell, NC (US);
Jonah Kadoko, Mint Hill, NC (US);
Daniel Pierce Armstrong, Apex, NC (US);
Matthew Hetrich, Raleigh, NC (US);
Cherif Ghoul, Raleigh, NC (US);
Krzysztof Kasza, Cracow, PL;
Lukasz Matysiak, Cracow, PL;
Hitachi Energy Ltd, Zürich, CH;
Abstract
A system and method for forming electrical devices via additive manufacturing processes that utilize starting materials that are in a solid state at least prior to, as well as after, the formation of the electrical device. A first solid starting material can be configured to form one or more insulator layers of the electrical device, while another solid starting material can be applied to form one or more electrically conductive layers. The starting materials can be applied layer-by-layer during formation of the electrical device such that the electrically conductive layers can become automatically embedded within the insulating layers, and vice versa. The additive manufacturing process(es) utilized to form the electrically conductive layers from solid starting materials can be different than the additive manufacturing process(es) utilized to form the insulator layers.