The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
May. 30, 2023
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Takeori Maeda, Mie Mie, JP;
Soichi Homma, Yokkaichi Mie, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 70/692 (2026.01); H10W 95/00 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 70/6875 (2026.01); H10W 70/692 (2026.01); H10W 95/00 (2026.01); H10W 72/072 (2026.01);
Abstract
According to one or more embodiments, a semiconductor device includes a support having a recess. A plurality of semiconductor chips are stacked on each other in the recess. A plurality of columnar electrodes in the recess extend from the semiconductor chips toward an opening of the support. A wiring layer is disposed over the opening. The recess is filled with an insulating material to cover the semiconductor chips and the columnar electrodes.