The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Mar. 16, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyungdon Mun, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package having a signal transfer path between semiconductor chips and a method of manufacturing the semiconductor package are provided. The semiconductor package includes a first redistribution substrate, a semiconductor chip stack arranged on the first redistribution substrate and including a lower chip and an upper chip, a through post arranged on the first redistribution substrate around the semiconductor chip stack, and a second redistribution substrate arranged on the semiconductor chip stack and the through post. The upper chip includes a through-electrode arranged on an integrated circuit layer, and has a front surface, which is an active face and faces the lower chip, and a back surface, which is an inactive face and faces the second redistribution substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile