The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Feb. 01, 2024
Applicant:
Allegro Microsystems, Llc, Manchester, NH (US);
Inventors:
Washington Lamar, Mont Vernon, NH (US);
Weidong Wang, Westford, MA (US);
Maxim Klebanov, Palm Coast, FL (US);
Sagar Saxena, Manchester, NH (US);
Yash Shaileshbhai Patel, Manchester, NH (US);
Assignee:
Allegro MicroSystems, LLC, Manchester, NH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 42/60 (2026.01); H10W 42/80 (2026.01); H10W 72/00 (2026.01); H10W 74/00 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/465 (2026.01); H10W 42/60 (2026.01); H10W 42/80 (2026.01); H10W 70/40 (2026.01); H10W 70/424 (2026.01); H10W 74/111 (2026.01); H10W 90/00 (2026.01); H10W 90/811 (2026.01); H10W 72/871 (2026.01); H10W 74/00 (2026.01); H10W 90/753 (2026.01); H10W 90/754 (2026.01); H10W 90/762 (2026.01); H10W 90/763 (2026.01);
Abstract
An integrated circuit package having more than one semiconductor die includes a spark gap to provide a current path designed to protect the device. The spark gap can be provided between an exposed portion of a corner lead and an exposed portion of a tie bar and/or between exposed portions of adjacent leads. The spark gap distance is designed to achieve required ratings for a given application. Stacked and side-by-side die configurations are described.