The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Aug. 18, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Naohide Tomita, Nagaokakyo, JP;

Hiroshi Nishikawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 20/20 (2026.01); H10W 20/42 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 72/90 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 20/20 (2026.01); H10W 20/42 (2026.01); H10W 70/614 (2026.01); H10W 70/65 (2026.01); H10W 70/657 (2026.01); H10W 44/209 (2026.01); H10W 44/234 (2026.01); H10W 44/248 (2026.01); H10W 72/926 (2026.01); H10W 72/9415 (2026.01); H10W 72/9445 (2026.01); H10W 80/721 (2026.01); H10W 80/743 (2026.01); H10W 90/722 (2026.01);
Abstract

A radio frequency module includes a mounting substrate including a first main surface and a second main surface opposite to the first main surface. A first electronic component is disposed on the first main surface of the mounting substrate. A second electronic component is disposed on the second main surface of the mounting substrate. A plurality of connection terminals are disposed on the second main surface of the mounting substrate. A wiring layer faces the second main surface of the mounting substrate. The wiring layer includes a plurality of external connection electrodes, each connected to at least one of the second electronic component and the plurality of connection terminals. At least one of the plurality of external connection electrodes overlaps the second electronic component when viewed in plan in a thickness direction of the substrate.


Find Patent Forward Citations

Tomita, Naohide. (2026). Radio-frequency module and communication device (U.S. Patent No. 12685176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12685176

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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