The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
May. 20, 2022
Applicant:
Teledyne E2v Semiconductors Sas, Saint Egreve, FR;
Inventors:
Assignee:
Teledyne e2v Semiconductors SAS, Saint Egreve, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H05K 1/181 (2026.01); H10W 44/20 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01); H10W 72/20 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H05K 1/181 (2013.01); H10W 70/685 (2026.01); H10W 90/701 (2026.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H10W 44/212 (2026.01); H10W 72/248 (2026.01); H10W 90/724 (2026.01);
Abstract
The invention relates to a flip-chip integrated circuit package of the ball array type, wherein: