The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Oct. 03, 2022
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Daisuke Goto, Tokyo, JP;
Hiroaki Ota, Tokyo, JP;
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H05K 7/20 (2006.01); H10W 40/60 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/253 (2026.01); H05K 7/2039 (2013.01); H10W 40/611 (2026.01); H10W 90/00 (2026.01);
Abstract
Provided is a heat dissipation member according to the present invention that includes a flat metal-silicon carbide composite containing aluminum, the heat dissipation member including: at least one through hole that penetrates the flat metal-silicon carbide composite in a plate thickness direction; a tapered portion where an inner diameter of the through hole gradually increases toward an outer side in a periphery of one or both end portions of the through hole; a metal portion containing aluminum that is formed on an inner surface of the through hole; and a screw hole that is formed in the metal portion.