The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Apr. 28, 2022
Applicant:
Huawei Technologies Co., Ltd., Guangdong, CN;
Inventors:
Assignee:
Huawei Technologies Co., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/20 (2025.01); H10D 1/68 (2025.01); H10W 20/40 (2026.01); H10W 20/41 (2026.01); H10W 20/42 (2026.01); H10W 44/20 (2026.01);
U.S. Cl.
CPC ...
H10W 20/497 (2026.01); H10D 1/20 (2025.01); H10D 1/692 (2025.01); H10W 20/42 (2026.01); H10W 20/423 (2026.01); H10W 20/427 (2026.01); H10W 20/496 (2026.01); H10W 44/20 (2026.01); H10W 20/435 (2026.01); H10W 44/206 (2026.01); H10W 44/209 (2026.01); H10W 44/241 (2026.01);
Abstract
The disclosure provides manufacturing methods and semiconductor devices. One example method includes that a semiconductor device includes a substrate and an inductor, where a shield layer is formed between the substrate and the inductor, and the shield layer is used to shield an electrical coupling between the substrate and the inductor.
Chen, Dong. (2026). Semiconductor device and manufacturing method therefor (U.S. Patent No. 12685151). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12685151
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile