The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Feb. 16, 2023
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Oscar Van Der Straten, Guilderland Center, NY (US);
Shanti Pancharatnam, Albany, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/53266 (2013.01);
Abstract
A semiconductor structure that includes: a plurality of metal wires, and at least one dielectric substrate surrounding the plurality of metal wires. Each of the plurality of metal wires includes a tapered upper portion, a tapered lower portion, and a middle portion between the tapered upper portion and the tapered lower portion that is wider than the tapered upper and lower portions.