The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Aug. 03, 2023
Western Digital Technologies, Inc., San Jose, CA (US);
Simon Yan, Shanghai, CN;
Jianhua Wang, Shanghai, CN;
Kaijian Shi, Shanghai, CN;
Bin Liu, Shanghai, CN;
Zhonghua Qian, Shanghai, CN;
Jim Zhang, Shanghai, CN;
Joyce Chen, Taichung, CN;
Juan Zhou, Shanghai, CN;
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
An integrated die ejector for separating a die from a wafer, the die ejector includes an ejector mechanism that includes an ejector pin. There is an ejector base coupled to the ejector pin and configured to couple the integrated die ejector to a die attach ejector machine. There is a pepper pot at least partially surrounding the ejector mechanism and ejector base and a sleeve coupled thereto and positioned between the ejector mechanism and pepper pot. The sleeve and pepper pot define an upper and lower motion limit of the ejector base and retain the ejector mechanism within the pepper pot such that the integrated die ejector may be coupled to and decoupled from the die attach ejector machine as a single unit to reduce installation time.