The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Aug. 22, 2023
Applicant:

Melexis Technologies SA, Bevaix, CH;

Inventor:

Appo Van Der Wiel, Tessenderlo, BE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 59/00 (2026.01); G01L 3/10 (2006.01); G01R 15/20 (2006.01); G01R 33/00 (2006.01); G01R 33/09 (2006.01); H10N 39/00 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10N 59/00 (2023.02); G01L 3/101 (2013.01); G01L 3/102 (2013.01); G01R 15/20 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/09 (2013.01); H10N 39/00 (2023.02); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
Abstract

A wafer-level packaged magnetic sensor device includes: a first semiconductor substrate having a processing circuit configured for receiving a plurality of sensor signals, and for determining at least one difference signal, and for providing an output signal derived from said difference signal. A plurality of sensor substrates include a second semiconductor substrate with a first magnetic sensor, and a third semiconductor substrate with a second magnetic sensor the first semiconductor substrate being arranged at a location between the plurality of sensor substrates. The substrates are electrically connected by means of at least one redistribution layer.


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