The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Nov. 08, 2022
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Andre Pertuit, Raleigh, NC (US);

Michael Check, Holly Springs, NC (US);

David Suich, Durham, NC (US);

Colin Blakely, Raleigh, NC (US);

Robert Wilcox, Rolesville, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/854 (2025.01); H10H 20/851 (2025.01); H10H 20/853 (2025.01); H10H 20/858 (2025.01);
U.S. Cl.
CPC ...
H10H 20/854 (2025.01); H10H 20/8516 (2025.01); H10H 20/853 (2025.01); H10H 20/8581 (2025.01); H10H 20/851 (2025.01); H10H 20/8512 (2025.01); H10H 20/8513 (2025.01);
Abstract

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly lumiphoric material structures for LED packages and related methods are disclosed. Cover structures with predefined color points for LED packages may include multiple lumiphoric material structures that are bonded together and arranged within LED packages. Lumiphoric material structures may include preformed and hardened structures, such as phosphor-in-glass or phosphor-in-ceramic, that are bonded together to form cover structures. Certain lumiphoric material structures include multiple sublayers of varying quantities and/or compositions of lumiphoric materials. Lumiphoric material structures with targeted color points may also be reduced to powder form and mixed within a binder for application in LED packages. Related methods include preforming cover structures of bonded lumiphoric material structures or assembling cover structures at a package level by separately arranging each lumiphoric material structure within LED packages.


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