The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

May. 31, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Minho Jang, Suwo-si, KR;

Doowon Kwon, Suwon-si, KR;

Doyeon Kim, Suwon-si, KR;

Kyungtae Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10W 90/00 (2026.01); H04N 25/77 (2023.01); H10W 80/00 (2026.01);
U.S. Cl.
CPC ...
H10F 39/809 (2025.01); H10F 39/018 (2025.01); H10F 39/811 (2025.01); H04N 25/77 (2023.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/792 (2026.01);
Abstract

An image sensor includes a lower substrate having a first surface and a second surface opposing the first surface, lower circuit devices disposed on the first surface, a lower wiring structure electrically connected to the lower circuit devices on the first surface, a lower bonding pad on the second surface, a lower bonding via penetrating through the lower substrate between the lower bonding pad and the lower wiring structure, a landing structure disposed on the first surface and contacting the lower bonding via, an upper bonding pad bonded to the lower bonding pad on the lower bonding pad, and an upper substrate disposed on the upper bonding pad and including photoelectric conversion devices. At least a portion of the landing structure horizontally overlaps the lower circuit devices.


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