The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Apr. 21, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided are an image sensor package with improved reliability and a method of fabricating the same. The image sensor package includes: a package substrate; an image sensor chip provided on the package substrate, and including a pixel area and a peripheral area surrounding the pixel area; a dam in the peripheral area, the dam having a rectangular ring shape and surrounding the pixel area; a transparent cover provided on the dam and covering an upper portion of the image sensor chip; and a sealing material sealing the image sensor chip and covering side surfaces of the transparent cover. The dam includes a stress relaxation layer (SRL) and a body layer on the SRL, and the SRL has a lower viscosity than a viscosity of the body layer.