The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Oct. 14, 2024
Applicant:

Cummins Inc., Columbus, IN (US);

Inventors:

Abhishek Khunte, Pune, IN;

Gautam M. Ghaisas, Pune, IN;

Vasant Rawool, Pune, IN;

Assignee:

Cummins Inc., Columbus, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02M 7/003 (2013.01); H05K 1/0209 (2013.01); H05K 7/20318 (2013.01); H05K 7/20336 (2013.01); H05K 7/20936 (2013.01);
Abstract

A power converter apparatus includes a parent circuit board including a first surface, a second surface, and a thermal conductor core disposed intermediate the first surface and the second surface. A first child circuit is board mounted on the parent circuit board. A first plurality of power switches are operatively coupled with the first child circuit board. A second child circuit is board operatively coupled with the parent circuit board. A second plurality of power switches are operatively coupled with the second child circuit board. A first heat transfer circuit includes a first set of conductors thermally conductively coupling the first plurality of power switches with the thermal conductor core. A second heat transfer circuit includes a second set of conductors thermally conductively coupling the second plurality of power switches with the thermal conductor core.


Find Patent Forward Citations

Khunte, Abhishek. (2026). Power converters which are scalable and/or provide a high degree of packaging density (U.S. Patent No. 12684744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12684744

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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