The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
May. 13, 2021
Hefei Boe Display Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Yunyun Liang, Beijing, CN;
Changcheng Liu, Beijing, CN;
Jiantao Liu, Beijing, CN;
Liugang Zhou, Beijing, CN;
Jianwei Sun, Beijing, CN;
Liu He, Beijing, CN;
Jun Wang, Beijing, CN;
Qing Li, Beijing, CN;
Yu Quan, Beijing, CN;
Yanting Huang, Beijing, CN;
Yunlu Chen, Beijing, CN;
Zhengru Pan, Beijing, CN;
HEFEI BOE DISPLAY TECHNOLOGY CO., LTD., Hefei, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
The present disclosure provides a circuit board, a chip on film, a display apparatus and a bonding method. The circuit board has a plurality of bonding regions for bonding with a chip on film, each bonding region includes: a plurality of first pins extending along a first direction and sequentially arranged along a second direction; and at least one first alignment mark group on an arrangement path along which the plurality of first pins are arranged and configured to be aligned with a second alignment mark group of the chip on film in a buckled way, so that the plurality of first pins are bonded and attached to second pins of the chip on film in one-to-one correspondence.