The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

May. 05, 2023
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Nitesh Kumbhat, San Jose, CA (US);

Yanfeng Chen, San Ramon, CA (US);

Mandar S. Painaik, Chandler, AZ (US);

Shankar S. Pennathur, San Jose, CA (US);

Pierpaolo Lupo, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H10W 74/01 (2026.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H10W 74/016 (2026.01); H05K 2203/1316 (2013.01);
Abstract

Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.


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