The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Aug. 24, 2023
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei Province, CN;
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Garuda Technology Co., Ltd., New Taipei City, TW;
Chao Wang, Hebei Province, CN;
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD., Hebei Province, CN;
AVARY HOLDING (SHENZHEN) CO., LTD., Shenzhen, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei City, CN;
Abstract
A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a flexible substrate, in which the flexible substrate includes a first portion, two second portions, two third portions, two first bending portion and two second bending portions. The flexible circuit board includes first connecting circuit layers extending from an upper surface of the first portion through the first portions to upper surfaces of the second portions, second connecting circuit layers extending from lower surfaces of the second portions through the third portions to lower surfaces of the third portions, first circuit layers disposed on the upper surface of the first portion and second circuit layers disposed on the lower surfaces of the third portions. Therefore, the flexible circuit board can achieve no-via-hole and high density for circuit board.