The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Dec. 22, 2022
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Hitoshi Ueno, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01C 19/5783 (2012.01); G01P 15/08 (2006.01); H05K 1/181 (2026.01); H05K 3/341 (2026.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G01P 15/0888 (2013.01); H05K 3/3421 (2013.01);
Abstract

A sensor module includes a circuit board, a sensor element having a detection axis along a planar direction of the circuit board, a sensor package accommodating the sensor element and mounted on the circuit board, a board land pattern used for mounting the sensor package disposed on the circuit board, and a package electrode disposed on a mounting surface of the sensor package facing the circuit board and joined to the board land pattern by a solder. A relationship of Xp≤X1 is satisfied, in which Xp is a width of the board land pattern in a first direction along the planar direction of the circuit board, and X1 is a width of the package electrode in the first direction.


Find Patent Forward Citations

Ueno, Hitoshi. (2026). Sensor module (U.S. Patent No. 12684693). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12684693

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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