The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Dec. 01, 2022
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Yoshiki Kawazu, Omihachiman, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09236 (2013.01);
Abstract

A wiring board includes an insulating substrate including a first surface, a mount portion positioned on the first surface and equipped with an electronic element, a first signal line and a second signal line positioned parallel to each other on the first surface, and a recess positioned on the first surface. The recess is positioned around a first end as an end of the first signal line and a second end as an end of the second signal line. At least part of the recess, the first end, and the second end are overlapped with the mount portion in a planar view.


Find Patent Forward Citations

Kawazu, Yoshiki. (2026). Wiring board and electronic device (U.S. Patent No. 12684684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12684684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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