The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Nov. 03, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Honkai Tomimoto, Tokyo, JP;

Hideki Kawashima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H04N 23/52 (2023.01); H04N 23/53 (2023.01); H04N 23/54 (2023.01); H05K 1/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H04N 23/52 (2023.01); H04N 23/53 (2023.01); H04N 23/54 (2023.01); H05K 1/14 (2013.01); H05K 7/20272 (2013.01); H05K 2201/042 (2013.01);
Abstract

An electronic apparatus includes a first board having a heat generating element, a second board, a support member having a fixing part to which the second board is fixed, and which supports the second board so as to overlap with the first board separated by a distance, and a heat dissipation member on an opposite side of the first board across the second board and the support member, so as to overlap with the second board separated by a distance. The support member includes a heat receiving part thermally connected to the heat generating element, a first heat transfer part which transfers heat received by the heat receiving part to the heat dissipation member, and a second heat transfer part which transfers heat received by the fixing part to the heat dissipation member. The support member has a shape which reduces heat transfer from the heat receiving part to the fixing part.


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