The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

May. 30, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Sai Lokesh Ladhagiri Krishnakumar, Hyderabad, IN;

Swarupa Gandhi Vudata, Hyderabad, IN;

Akash Kumar, Hyderabad, IN;

Sumitkumar Shrikant Dubey, Hyderabad, IN;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 52/14 (2009.01); H04W 52/34 (2009.01);
U.S. Cl.
CPC ...
H04W 52/146 (2013.01); H04W 52/346 (2013.01);
Abstract

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may apply a per chain transmit power split to a cumulative maximum transmit power level (MTPL). The UE may calculate a value associated with a conditional power backoff, wherein the value associated with the conditional power backoff is calculated after the per chain transmit power split is applied to the cumulative MTPL. The UE may transmit, using multiple transmit chains, an uplink signal using a final transmit power level, wherein the final transmit power level is based on a value of the cumulative MTPL after the per chain transmit power split is applied to the cumulative MTPL and the calculated value associated with the conditional power backoff. Numerous other aspects are described.


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