The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Aug. 07, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Linhai He, San Diego, CA (US);

Iyab Issam Sakhnini, San Diego, CA (US);

Diana Maamari, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 28/02 (2009.01); H04W 72/1268 (2023.01);
U.S. Cl.
CPC ...
H04W 28/0278 (2013.01); H04W 72/1268 (2013.01);
Abstract

Aspects described herein relate to encoding a buffer size in a buffer status report based on a newly defined buffer size table that can have reduced step sizes for larger buffer sizes. Other aspects relate to decoding the buffer size in the buffer status report. The newly defined buffer size table can better accommodate buffer size reporting for high data throughput applications.


Find Patent Forward Citations

He, Linhai. (2026). Techniques for using buffer size tables for high data throughput in wireless communications (U.S. Patent No. 12684409). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12684409

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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