The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Jul. 25, 2024
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chiyoung Park, Suwon-si, KR;

Manho Kim, Suwon-si, KR;

Youngsoo Jang, Suwon-si, KR;

Bongchan Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/55 (2023.01); H04N 23/51 (2023.01); H04N 23/57 (2023.01); H04N 23/68 (2023.01);
U.S. Cl.
CPC ...
H04N 23/55 (2023.01); H04N 23/51 (2023.01); H04N 23/57 (2023.01); H04N 23/68 (2023.01);
Abstract

Disclosed is a camera module including a lens that includes an optical axis, a lens housing to accommodate the lens, an image sensor to receive light passing through the lens, a connector to receive an electrical signal from the image sensor, and a flexible printed circuit board to connect the image sensor and the connector. The FPCB changes between a first configuration in which the FPCB extends substantially linearly between the image sensor and the connector, and a second configuration in which the FPCB has at least three bent areas, at least two folded areas, and at least two side areas along a perimeter of the image sensor.


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