The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Jul. 24, 2024
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Toshiaki Takata, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/02 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0561 (2013.01); H03H 9/02866 (2013.01); H03H 9/059 (2013.01); H03H 9/25 (2013.01); H03H 9/6483 (2013.01); H03H 9/725 (2013.01);
Abstract

A filter includes a series arm resonator, parallel arm resonators, a multilayer substrate including main surfaces, a piezoelectric substrate, and a bump electrode on the piezoelectric substrate. Each of the parallel arm resonators include an IDT electrode on the piezoelectric substrate. The bump electrode is connected to the IDT electrode. The multilayer substrate includes a first planar electrode on a first of the main surfaces and bonded to the bump electrode, a second planar electrode on a second of the main surfaces and connected to a ground, and via conductors that connect the first and second planar electrodes. In a plan view of the first main surface, the bump electrode is between via conductors connected to the first planar electrode.


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